MPIC 2023 Updates and Fixes.
Below are the major issue fixes and updates:
· When switching from different simulation tab, the boundary condition (loads or constraint) symbols are properly shown without user refreshing.
· Fix acceleration "Set Direction" not showing the proper dialog issue.
· Fix AddFea toolbar button not being enabled when all simulation tabs are deleted.
· Fix contour legend not showing up the first time for some models.
· Update the boundary condition selection options for both Constraint and Loads so all geometry types (body, vertex, face and edge) can be selected.
· Update the analysis tab model changing re-display control such that it will allow user to control the automatic reload of result model.
· The discrete Boolean union retry tolerance setting has been updated to range from 0.1x to 1000x of the default value.
· Multiple Nonlinear Multipliers are now available for nonlinear material properties or boundary condition scaling with different dependency such as on time/step, strain and temperature, etc.
· Fix displacement magnitude and equivalent stress in Analysis Report such that they match the Images.
· Fix Material page "update bodies" button not enabled.
· Fix Analysis tree display not showing UseLsThermal flag when it is turned on.
· Fix tie constraint Advanced setting button not enabled.
· Correct acceleration dialog always sets acceleration default parameter to metric unit rather than user’ unit.
· When both thermal and fluid are selected, editing xyz heat flux values in temperature dialog are enabled.
· Fix bug of About Analysis Dialog not using the last modified date.
· Fix bug of material parts selection with duplicate setting.
· Implement file version check between icampsres.dll and icamps.dll to issue warning if not identical for localized version.
· Fix Rigid Rotation Unit change cannot be saved issue.
· Fix bug in Rigid Rotation radian/degree issue (always use radian bug).
· Multiple glue groups are controlled by the global glue/separate setting, rather than default to glue.
· Enhance glue meshing by removing regions created from small overlap of parts.